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 QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR -- Surface Mount Silicon Pin Photodiode
August 2008
QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Surface Mount Silicon Pin Photodiode
Features
Daylight Filter (QSB34GR and QSB34ZR only) Surface Mount Packages: Large Chip Size = 3mm x 3mm Sensitive Area - 2.55mm x 2.55mm High Sensitivity Low Capacitance Available in 0.470" (12mm) width tape on 7" (178mm)
- QSB34GR/QSB34CGR for overmount board - QSB34ZR/QSB34CZR for undermount board Fast PIN Photodiode Wide Reception Angle, 120
diameter reel; 1,000 units per reel
Package Dimensions, QSB34GR
Anode
4.50 4.30 Chip 1.70 1.50 4.00 3.80 0.90 0.70 1.50 Package Center 0.175 Chip Center
Schematic
ANODE CATHODE
Photosensitive surface
0.17 0.13 0.80 0.70 1.20
4.00 3.80
0.10 Min
0-5
6.70 6.10
Notes: 1.Dimensions for all drawings are in mm. 2.Tolerance of .0.13 on all non-nominal dimensions unless otherwise specified.
(c)2000 Fairchild Semiconductor Corporation QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Rev. 1.0.3
www.fairchildsemi.com
QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR -- Surface Mount Silicon Pin Photodiode
Absolute Maximum Ratings (TA = 25C unless otherwise specified)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol
TOPR TSTG TSOL VR PC
Parameter
Operating Temperature Storage Temperature Soldering Temperature Reverse Voltage Power Dissipation at (or below) 25C Free Air Temperature
Rating
-25 to +85 -40 to +85 260 32 150
Unit
C C C V mW
Note: 1. Soldering time 5 seconds
Electrical/Optical Characteristics (TA =25C unless otherwise specified) The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings.
Symbol Parameter
VR IR(D) PK IPH C tr tf 0.5 Reverse Voltage Dark Reverse Current Peak Sensitivity Reception Angle @ 1/2 Power Photo Current Capacitance Rise Time Fall Time Spectral Sensitivity QSB34GR, QSB34ZR QSB34CGR, QSB34CZR Ee = 1.0mW/cm2, VCE = 5V(4) 25 VR = 3V VR = 10V, RL = 50 VR = 10V, RL = 50 730 400
Test Conditions
IR = 0.1mA VR = 10V VR = 5V
Min.
32
Typ.
Max.
30
Units
V nA nm A pF ns ns
940 60 37 25 50 50 1100 1100
nm
(c)2000 Fairchild Semiconductor Corporation QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Rev. 1.0.3
www.fairchildsemi.com 2
QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR -- Surface Mount Silicon Pin Photodiode
Typical Performance Curves
Fig. 1 Relative Spectral Sensitivity vs. Wavelength
1.0
RELATIVE SPECTRAL SENSITIVITY
Fig. 2 Short Circuit Current vs. Irradiance
80 ISC - SHORT CIRCUIR CURRENT (A)
QSB34CGR, QSB34CZR
0.8
60
0.6
40
0.4
20
0.2 QSB34GR, QSB34ZR 100 300 500 700
Ta = 25C 900 1100 1300
VR = 5V = 940nm 0 0 0.5 1.0 1.5 Ee - IRRADIANCE (mW/cm2)
0
- WAVELENGTH (nm)
Fig. 3 Capacitance vs. Reverse Voltage
80 f = 1 MHz H = 0mW/cm2 60
IR - DARK CURRENT (nA) CAPACITANCE (pF)
Fig. 4 Dark Current vs. Temperature
1000
100
40
10
20
VR = 10 V Ee = 0mV/cm2 0 0.1 1 10 100 VR - REVERSE VOLTAGE (V) 1 20 40 60 80 TA -TEMPERATURE (C) 100
Fig. 5 Dark Current vs. Reverse Voltage
1200 Ee = 0mV/cm2 1000
IR -DARK CURRENT (pA)
Fig. 6 Response Time vs. Load Resistance
101 VR = 10V TA = 25C 100
800 600 400 200 0 0 2 4 6 8 10 12 14 16 18 20
RESPONSE TIME tr, ff (s)
10-1
10-2
10-3 101
102
103
104
105
VR - REVERSE VOLTAGE (V)
LOAD RESISTANCE RL ()
(c)2000 Fairchild Semiconductor Corporation QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Rev. 1.0.3
www.fairchildsemi.com 3
QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR -- Surface Mount Silicon Pin Photodiode
Package Dimensions, QSB34ZR Package Dimensions
Anode
4.50 4.30 Chip 1.70 1.50 4.00 3.80 0.90 0.70 1.50 Package Center 0.175 6.70 6.10 Chip Center
Recommended Solder Screen Pattern (For Reference Only)
7.4 4.3
1.8
1.55 Note: 1. All dimensions in mm 2. Pattern applies to both QSB34GR and QSB34ZR
0.20 0.10
Photosensitive surface
1.10 0.90 0.10
0-5
1.20 0.012 (0.30)
Note: 1. Dimensions for all drawings are in mm. 2. Tolerance of .0.13 on all non-nominal dimensions unless otherwise specified.
Recommend IR Reflow Soldering Profile
1 ~ 3C/sec. 260C Max. 10sec. Max. 1 ~ 3C/sec. Pre-heating 180 ~ 200C 60sec. Max. Above 220C
120sec. Max.
(c)2000 Fairchild Semiconductor Corporation QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Rev. 1.0.3
www.fairchildsemi.com 4
QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR -- Surface Mount Silicon Pin Photodiode
Ordering Information
Option
QSB34GR QSB34ZR QSB34CGR QSB34CZR
Description
Gullwing, 1000 units per reel Z-Bend reversed, 1000 units per reel Gullwing, 1000 units per reel Z-Bend reversed, 1000 units per reel
Tape & Reel Dimensions
O130.5
2.5
0 0
.5
13.21.5 16.00.2
O60.20.5
O1781.0
CATHODE
O1.50.1
2.00.05
4.00.10
1.750.10
5.50.05
12 +0.3 -0.1
9
COVER TAPE
4.200.10
O1.500.25
8.00.10
1.450.10
Unit: mm
(c)2000 Fairchild Semiconductor Corporation QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Rev. 1.0.3
www.fairchildsemi.com 5
6.900.10
2.5 0.5 0
QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR -- Surface Mount Silicon Pin Photodiode
TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. Build it NowTM CorePLUSTM CorePOWERTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) EfficentMaxTM EZSWITCHTM * TM
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* EZSWITCHTM and FlashWriter(R) are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete Product Status Formative / In Design First Production Full Production Not In Production Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I35
(c)2000 Fairchild Semiconductor Corporation QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Rev. 1.0.3
www.fairchildsemi.com 6


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